Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Product Benchmarking, Process Outlook & Regional Scope 2027
Research Reports
May 25, 2022
Market Overview
The global hybrid memory cube and high bandwidth memory market is valued at USD 1.23 billion in 2020, and it is expected to increase at a CAGR of 31.70 per cent from 2020 to 2026, with a hybrid memory cube and high bandwidth memory market size of USD 11.12 billion by 2026.
Both AMD & Hynix and Silicon-Vias designed the hybrid memory cube and high bandwidth memory market, which are high-performance RAM interfaces. Because of their superior qualities such as high bandwidth, small form factor, and low cost, these two RAM interfaces are used for stacked DRAM memory. Both are intended to change memory access speed and overall performance because this combination permits simultaneous access to several memory blocks. Network devices and high-performance graphics processing units are utilized in conjunction with high-bandwidth memory.
Both interfaces work in the same way when it comes to RAM. The graphical processing unit and high bandwidth memory are both included in the RAM package. As a result, HBM outperforms HMC in terms of delivering tightly coupled high-processing units. HMC devices use a separate processor, similar to a chain, to increase the memory capacity of the device. Because these two HMC and HBM can overcome the bandwidth limitation that affects GPU performance, it is expected that these GPUs would perform well. These gadgets boost the performance of the GPU by over 40%. Network and communication technology applications employ these devices.
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Market Segmentation
Memory type, product type, application, and location have all been used to segment the global hybrid memory cube and high bandwidth memory market.
Depending on the Memory Type: The global hybrid memory cube and high bandwidth memory market is divided into two types of memory: hybrid memory cube (HMC) and high bandwidth memory (HBM) (HBM).
Depending on the Product Type: By product type, the HMC and HBM are divided into five categories: CPU, FPGA, GPU, ASIC, and accelerated processing unit.
Application-specific: Networking and communications, data centres, consumer electronics, rising computing (HPC), and many other sorts of applications use hybrid memory cubes and high bandwidth memory.
Depending on the location: Asia-Pacific, North America, Europe, and the Rest of the World are the four primary geographies in which the global hybrid memory cube and high bandwidth memory market are divided. For the presence of a significant number of data centres and their application, North America has the biggest market share.
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Regional Classification
The market for hybrid memory cubes (HMCs) and high bandwidth memories (HBMs) is divided into four primary regions: Europe, North America, Asia-Pacific, and the Rest of the World. Because of the large number of data centres and their use, North America has the biggest hybrid memory cube and high bandwidth memory market share among these areas. The market in this region is growing due to the strong demand for high-performance computing and the crucial role of hybrid memory cubes.
Industry News
The market scenario comprises market drivers, restrictions, challenges, and opportunities for hybrid memory cubes and high bandwidth memory. Memory type, product type, application, and region are the four sectors of the hybrid memory cube and high bandwidth memory market forecast.
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