Liaison Technologies Accepting Applications for Spring Semester 2019 Data-Inspired Future Scholarship

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Oct 04, 2018

ATLANTA, Oct. 4, 2018 /PRNewswire/ — Liaison Technologies, a leader in cloud-based integration and data management solutions, is now accepting applications for the Liaison Data-Inspired Future Scholarship for the 2019 spring semester. The scholarship is for students interested in pursuing careers in data by both helping to solve challenges and drive innovation in society and business. Eligible high school and college students are invited to submit a video and résumé for consideration by October 31; the spring scholarship recipient will be announced November 30.

Liaison Technologies

The biannual Liaison Data-Inspired Future Scholarship aims to encourage students to seek careers in today’s rapidly growing digital world and to empower and help equip the newest generation of leaders in the data industry. The scholarship program awards two high school seniors or college students each year with $5,000 to be used toward educational expenses of their choosing. Applicants are sought and scholarships awarded before the fall and spring semesters.

“The last decade has brought on significant change and advancement in our daily lives in regard to data and technology,” said Pamela Osborne, director of human resources for Liaison Technologies. “Data from innovative new cloud-based applications as well as that generated by artificial intelligence, machine learning and other new automated tools is now being used to analyze and solve problems in ways never seen before. This allows enterprises to explore and create new opportunities through digital transformation. Liaison’s Data-Inspired Future Scholarship is designed to inspire students to pursue data-related careers by acknowledging and embracing the increasing demand for data professionals in our workforce.”

The past three recipients of the scholarship embody what it means to be outstanding students seeking to solve complex problems through data. The most recent winner, Namankita Rana, attends Stevens Institute of Technology and plans to use data science and machine learning to analyze data and make predictions that benefit various causes. She is especially interested in the social responsibility imperatives emerging with machine learning and how to limit injecting human bias into the data we feed into our machines. The first winner of the Liaison Data-Inspired Future Scholarship in 2017 was Antonio Ferris who now attends Stanford University. He plans to pursue a career in data research to help expand machine learning and artificial intelligence applications into new fields. The second winner of 2017, Zoe Sheill, plans to pursue a career in computer science and examine ways in which both artificial intelligence and data can be used to instigate positive changes in the world.

The Liaison Data-Inspired Future Scholarship encourages the discovery and acceleration of data-driven solutions and furthers the technological and digital advancements of our society. As digital transformation continues to provide access to more data from more diverse sources, the need for students to choose careers in data fields and for professionals to integrate, manage and secure data will also increase. The ability to analyze and draw conclusions from data while simultaneously keeping that data protected and secure will be crucial to positive change. This scholarship assists the most exceptional students who will instigate this change in society.

Students interested in applying for the Liaison Data-Inspired Future Scholarship must submit a 30- to 60-second video that highlights an important aspect of data in society and includes at least one interesting fact about themselves. Applicants must also specify the college they plan to attend as well as their intended major/minor. The video should be uploaded to a public platform like YouTube or Vimeo. Applicants must then email a résumé and the video URL to scholarship@liaison.com. Be sure to specify intended college and major/minor in this email and résumé.  Scholarship recipients have no obligation to Liaison, and no credit card or Social Security Number information is required to apply.

The scholarship is available to citizens and legal permanent residents of the United States and Canada. College students may be enrolled in undergraduate or graduate programs. Qualifying schools must be located in the United States or Canada. Liaison may make an exception for international programs, but applicants should disclose their plans to participate in an international program when they submit their application.

The application deadline for the spring semester scholarship of 2019 is October 31, 2018, with the winner being announced on November 30, 2018.

For more information, including application details, visit www.liaison.com/scholarship.

Liaison Technologies is leading the way in helping enterprises achieve a data-inspired future with the award-winning Liaison ALLOY® Platform. ALLOY is built from the ground up to address the data integration and data management challenges organizations face in today’s rapidly expanding data landscape. To learn more, visit www.liaison.com/liaison-alloy-platform.

About Liaison Technologies

Liaison Technologies provides integration and data management solutions to help customers unlock the power of a data-centric approach to their business. Liaison’s cloud-based approach breaks down the barriers between data silos to tap into the valuable information needed to make better decisions, faster. Tailored to solve complex data problems today while building a robust foundation for tomorrow’s unforeseen challenges, Liaison fosters a seamless flow of information securely and at scale. Founded in 2000, Liaison serves more than 7,400 customers in 46 countries, with offices in the United States, the Netherlands, Finland, Sweden, the United Kingdom and Singapore. For more information, visit www.liaison.com and connect with Liaison on Twitter, LinkedIn and Facebook.

Media Contact: Emma Tiernon, etiernon@sspr.com

 

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SOURCE Liaison Technologies

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