High Density Interconnect PCB Market to Touch USD 21,823.6 Million at 17.3% CAGR by 2032
Research Reports
Nov 09, 2023
High Density Interconnect PCB Market Analysis
The global high density interconnect PCB market will touch USD 21,823.6 million at a 17.3% CAGR by 2032, as per the recent Market Research Future report.
Drivers
Increasing Sales of Consumer Electronics to Boost Market Growth
The increasing sales of consumer electronics as well as a substantial increase in the need for high density interconnect PCBS in such applications will boost market growth in the forecast period. Thus the consumer electronics sector is becoming a vital end user market for the high-density technology. Presently, application of such boards in the consumer electronics devices such as tablets, gaming consoles, smart wearables, smartphones, and others are indeed significant. Thus, with the burgeoning need and production of such devices the market is likely to develop in the assessment period.
Opportunities
Increasing Adoption in Wearable Technology to offer Robust Opportunities
The increasing adoption of high density interconnect PCBs in wearable technology will offer lucrative opportunities for the high density interconnect PCB market in the forecast period. Owing to its lightweight and great performance, the HDI boards are ideal to supply power to the wearable technology. Various tools to track health and fitness are accessible with smart wearables such as smartwatches and fitness trackers.
Restraints and Challenges
High Construction Cost to act as Market Restraint
The high construction costs coupled with the incompatibility of the high density interconnect PCBs with limited user interface programs may act as market restraints over the forecast period.
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Key Players
- Eminent market players profiled in the global high density interconnect PCB market report include Unimicron,
- Epec,
- LLC,
- TTM Technologies Inc.,
- RayMing Technology,
- HiTech Circuits,
- NCAB Group Corporation,
- Millennium Circuits Limited,
- Tripod Technology,
- Zhen Ding Tech. Group Technology Holding Limited,
- AKM Meadville,
- Meiko Electronics Co., Ltd.,
- Sierra Circuits Inc.,
- Compeq Manufacturing Co., Ltd,
- AT & S (Austria Technologie & Systemtechnik Aktiengesellschaft),
- Advanced Circuits,
- DAP Coroporation.
Market Segmentation
The global high density interconnect PCB market is bifurcated based on application and interconnection layers.
By interconnection layers, all layers HDI will lead the market over the forecast period.
By application, automotive will domineer the market over the forecast period.
COVID-19 Analysis
The COVID-19 epidemic possessed mixed impacts on the high-density interconnect PCB market. During the initial stages, the market faced supply chain disruptions, fall in demand for electronic goods, and manufacturing slowdowns. But on the later stage, there had been an increasing need for electronic components and devices for supporting healthcare, online education, and remote work, thus having a positive impact.
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Regional Analysis
APAC to Head High Density Interconnect PCB Market
The APAC region will head the high density interconnect PCB market over the forecast period for the increasing use of HDI in sectors such as healthcare, consumer electronics, and automotive in South Korea, India, and China. As the demand of the Western nations for the Asian consumer electronics skyrocketed, this market grew even more. Besides, the increasing disposable income of the region has also led to the growth in the usage of household appliances that will improve the regional market all through the assessment period.
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