Semiconductor Bonding Market is projected to reach USD 0.89 billion by 2030, at a CAGR of 3.11% during the forecast period 2022-2030.

Research Reports

Sep 18, 2023

The global semiconductor bonding market is rising continually, witnessing massive demand from the burgeoning ICT and consumer electronics market. Moreover, the latest trend of miniaturization of electronic devices that requires more complex designs and more adaptable bonding processes accelerates market shares, creating massive market demand.  

Market Research Future (MRFR) asserts that the global semiconductor bonding market is expected to escalate from USD 0.72 BN in 2022 to USD 0.89 BN by 2030, expanding at a 3.11% CAGR during the anticipated period (2022-2030). The market proliferation of smartphones and other wearable devices worldwide defines the growing market landscape. 

Other factors bolstering the market size include the substantial growth in the electric vehicles and automotive industries worldwide. Moreover, advances in bonding technologies act as a significant driving force behind the market rise. Mobile phones and smartphones are prominent examples. Similarly, housing motion sensors, gyroscopes, microphones, and speakers are others. 

On the flip side, high costs and complexities associated with chip designing are prompting many chipmakers to start splitting that chip down into several sections. Nevertheless, the increased demand from the electronics and telecommunication industries would provide a considerable impetus to the market growth during 2022-2030. Also, accelerating hybrid bonding technology and innovations in 3D chip integration technologies would push the market growth, driving the semiconductor and computing industries.  

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Major Players

Leading semiconductor bonding market players include

  • ASM Pacific Technology Ltd. (Singapore)
  • Kulicke & Soffa (Singapore)
  • BE Semiconductor Industries NV (Netherlands)
  • Fuji Corporation (Japan)
  • Yamaha Motor Robotics Corporation Co. (Japan)
  • Panasonic (Japan)
  • SUSS MicroTech SE (Germany)
  • Shiaura Mechatronics (Japan), among others. 

Semiconductor Bonding Market – Segmentation

MRFR has segmented the market into types, process types, technologies, applications, and regions. Of these, the type segment is bifurcated into die bonder, wafer bonder, flip-chip bonder, and others. Similarly, the process type segment is bifurcated into wafer-to-wafer bonding, die-to-wafer bonding, and die-to-die bonding. 

The technology segment is bifurcated into epoxy die bonding, die bonding, eutectic die bonding, hybrid bonding, flip-chip attachment, wafer bonding, anodic wafer bonding, direct wafer bonding, hybrid bonding, TCB wafer bonding, and others. The application segment is bifurcated into RF Devices, MEMs & sensors, CMOS image sensors, LED, 3D NAND, and others. 

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Semiconductor Bonding Market – Regional Analysis

Globally, APAC holds the largest semiconductor bonding market share due to the augmented market penetration of consumer electronics and smartphones. APAC countries such as China, India, and Japan drive the regional market, majorly witnessing the growing penetration of high-tech gadgets, rising miniaturization of electronics, and developments of auto electronics.

Besides, factors such as growing digitization, rapid industrialization, and economic development in the region foster market growth. Additional factors pushing up the regional market growth include the growing uptake of bonding processes in electric vehicle components manufacturers such as printed circuit boards, lithium-ion batteries, and battery pack assemblies.

Semiconductor Bonding Market – Competitive Analysis 

Highly competitive, the global semiconductor bonding market appears fragmented. Players incorporate strategic approaches such as mergers & acquisitions, expansion, collaboration, and product/ technology launches to gain a larger competitive advantage. These players invest substantially to transform the consumer and business landscape. 

Industry/ Innovation/ Related News:

Mar. 28, 2023 — Adeia Inc. (ADEA), a leading electronics technology company, announced a long-term agreement with Kioxia Corporationa leading provider of flash memory and solid-state drives. Under the agreement, Kioxia will help ADEA license its semiconductor patent portfolio, including hybrid bonding.

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